Iworkshop yeJWT
INDLELA EZENZIWA NGAYO IMVELISO KWI-JWT？
Indawo yokusebenzela yokuxuba iSilicone
Ngokwesiqhelo, eli linyathelo lethu lokuqala.
Lo matshini wokusila usetyenziselwa ukuxuba iintlobo ngeentlobo zezinto zeSilicone kuxhomekeke ekusebenzeni kwemveliso eyahlukileyo, umzekelo, Imibala kunye noBulukhuni. Nawuphi na umbala unokwenzeka njengoko unqwenela, Ubulukhuni ukusuka kwi-20 ~ 80 Shore A buxhomekeke kwiimfuno zakho.
Ukubumba iRubber Vulcanization
Indawo yokusebenzela yokubumba ineeseti ezili-18 zomatshini wokubumba we-vulcanization (200-300T).
Eli linyathelo elibaluleke kakhulu lokuguqula iSilicone Material ibe yimbonakalo yemveliso yombono. Ingavelisa iindawo ezintsonkothileyo nezihlukeneyo zemilo kuxhomekeke kumzobo womthengi, kungekuphela nje ekubumbeni iSilicone okanye izinto zerabha, Ungadibanisa iPlastiki okanye iMetal neSilicone, naluphi na uyilo lunokwenzeka.
Umatshini wokubumba we-LSR (iRabha ye-SIlicone yolwelo)
Umatshini wokubumba i-silicone engamanzi unokuvelisa iimveliso ze-silicone ezichanekileyo kakhulu. Imveliso ingalawulwa ngaphakathi kwe-0.05mm. Izinto ze-silicone ukusuka kwibharele ukuya kwi-mold azinakungenelela komntu ukuqinisekisa ukuba yonke inkqubo yemveliso ayinangcoliseko.
Lo matshini unokuvelisa iimveliso ezisetyenziswa kushishino lwemveliso zonyango, ze-elektroniki kunye negumbi lokuhlambela.
Indawo yokusebenzela yokujova ngeplastiki
Ukubumba ngenaliti kusetyenziswa ukuvelisa iimveliso zeplastiki.
Sineeseti ezili-10 zomatshini wokubumba inaliti onenkqubo yokondla ezenzekelayo kunye nengalo yoomatshini, sinokubonelela ngezinto kunye nokukhupha imveliso egqityiweyo ngokuzenzekelayo. Imodeli yomatshini ukusuka kwi-90T ukuya kwi-330T.
Indawo Yokusebenzela Yokutshiza Ngokuzenzekelayo
Indawo yokusebenzela yokupeyinta ngesitshizi Igumbi elicocekileyo.
Emva kokutshizwa, iimveliso ziya kuba kumgca we-IR we-18m ngqo ukuze zibhakwe, emva koko imveliso igqityiwe.
Indawo Yokusebenzela Yokukrola NgeLaser
Ukuprinta isikrini yindlela yokuprinta apho i-mesh isetyenziselwa ukudlulisa i-inki kwi-substrate, ngaphandle kweendawo ezingenakungenwa yi-inki nge-stencil evimbayo. I-blade okanye i-squeegee ihanjiswa kwisikrini ukuze kuzaliswe i-mesh apertures evulekileyo nge-inki, kwaye ukubethelwa okungasemva kubangela ukuba isikrini sichukumise i-substrate okomzuzwana kumgca wokuthintana.
Indawo yokusebenzela yokuprinta isikrini
Kubalulekile ukuqaphela ukuba iikeypad zerabha zesilicone zihlala zikrolwa nge-laser ukuphucula imiphumo yokukhanyisa emva. Ngokukrolwa nge-laser, i-laser enamandla aphezulu isetyenziselwa ukunyibilikisa nokususa ipeyinti kwiindawo ezithile zomaleko ophezulu. Nje ukuba ipeyinti isusiwe, ukukhanya kwangasemva kuya kukhanyisa ikeypad kuloo ndawo.
Ilebhu yovavanyo
Uvavanyo yeyona nto iphambili ukuqinisekisa ukuba iimveliso zethu zichanekile kwaye ziyahlangabezana neemfuno zabathengi, siza kuvavanya izinto eziluhlaza, imveliso yokuqala yokubumba, imveliso ephakathi kunye nemveliso yokugqibela ngexesha le-IQC, IPQC, OQC.